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A new method of curing epoxy resin by using bis(heptaphenylaluminosilsesquioxane) as a hardener

D. Chmielewska    M. Barczewski    T. Sterzyński   
270-275
2013-04-30


Epoxy compositions and materials cured with complexes of imidazoles and Cu(II) cations

R. Pilawka    T. Spychaj    A. Leistner    M. El Fray   
526-530
2022-08-23


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